The project includes partners from industry (STM, MAPPER) as well as major research institutes and universities (IMEC, CEA-LETI, INL, UNITN). Both partners with a strong background in electronics as partners with an outstanding track record in photonics are part of the consortium. ST Microelectronics is one of the world leading suppliers of electronic ICs while IMEC and CEA-LETI are the largest European research institutes on microelectronics. Mapper Lithography, a Delft University spin-off is developing a massively parallel ebeam writing system for future electronic circuit fabrication. On the other hand, UNITN, INL and the IMEC photonics research group are part of the world leading research groups on optics and photonics.
IMEC coordinates the project and will design ultra-compact SOI waveguide circuits for routing and demultiplexing. IMEC will also contribute to the fabrication of the sources and their integration with the waveguides. ST Microelectronics is investigating the viability of optical networks-on-chip and will design the required CMOS-circuits. CEA will develop the integration process and fabricate the photonic layer in a standard CMOS pilot line, including the III-V based microsources. INL is involved in the design and fabrication of the microsource arrays, will contribute to the optoNoC system studies and will be responsible for the design of the optical routers. UNITN will design innovative optical WDM circuits based on coupled ring resonators. MAPPER will be responsible for the system studies related to the terabit optical link.
IMEC (project coordinator)
Photonics Research Group, Ghent University, Ghent (B)
OCCS-group, Catania (It)
Silicon photonics group, Grenoble (F)
INL Lyon Institute of Nanotechnology
Ecole Centrale de Lyon, Lyon (F)
LPM group at INSA de Lyon, Lyon (F)
UNITN - Trento University
Silicon photonics group, Trento (It)
Maskless Lithography, Delft (NL)